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Simulating and Optimizing Flow Fields in Product Design using CFD

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Overview

Concurrent CFD enables users to conduct CFD analysis entirely within a mechanical CAD (MCAD) environment, where it is used concurrently with all the other tools in the normal menu structure. As a result, mechanical engineers can treat CFD as a routine operation where designs can be analyzed and optimized during the design process, delivering better, more reliable products in a shortened time scale.

A good example for demonstrating the complexities of flow fields and its ultimate influence on temperature management is with a convection oven. Convection ovens can offer better cooking quality and lower energy consumption over conventional ovens. The enhanced heat transfer produced from the forced air movement results in reduced oven heating times. However, airflow patterns within the oven are not uniform because the number of shelves, trays and the loading of items can have a significant impact on the flow patterns within the space and can result in un-even temperatures in different parts of the oven space. To illustrate this, the presenter will demonstrate how the flow field within the oven may be simulated and visualized in detail, enabling the designer to better understand the ovens effectiveness. Simulations of various tray-loading scenarios will be examined and design recommendations will be discussed.

What You Will Learn

  • Understand the impact of design or loading changes and how it can affect the flow field
  • Visualize temperature and flow distributions in a virtual 3D environment
  • Perform fluid flow and analysis using a FloEFD wizard and your familiar MCAD interface
  • Efficient ways to share detailed reports with design teams, management and customers
     

About the Presenter

Presenter Image John Wilson

John Wilson joined Mentor Graphics Corporation, Mechanical Analysis Division (formerly Flomerics Ltd) after receiving his BS and MS in Mechanical Engineering from the University of Colorado at Denver. Since joining in 1999, John has worked on or managed more than 70 thermal and airflow design projects.

His modeling and design knowledge range from component level to Data Centers, heat sink optimization and compact model development. John has extensive experience in IC package level test and analysis correlation through his work at Mentor Graphics' Fremont based Thermal Test Facility.

He is currently the Application Engineering Manager, in the Western Region, for the Mechanical Analysis Division.

Who Should View

  • Design Engineers
  • Mechanical Engineers
  • Product Design Managers
  • MCAD Engineers who are currently interested in a truly concurrent CFD analysis solution
     

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