T3Ster Validation of Thermal Models of IC Packages and More
On-demand Web Seminar
Learn how Thermal Transient Tester (T3Ster) equipment can be used to generate Compact Thermal Models (CTMs) for use in thermal design to improve junction temperature prediction.
Getting hold of chip package CTMs for use in board and system-level thermal analyses can be tricky, as not all vendors provide them. Until now the ability to create thermal models direct from measurements on actual parts has not been possible. T3Ster records the change in die temperature in response to a power step applied to the device. The packaged semiconductor device measured by T3Ster can be any active part, like a discrete diode, BJT, JFET, MOSFET, IGBT, thyristor, a memory module processor, or even a power LED. Data processing of the temperature vs. time response yields reveals the detailed internal structure of the part, analogous to the way X-rays show internal details of the human body, by recording changes in material properties and geometry along the heat flow, resolving the thermal resistances and capacitances of the die, die attach, die pad, substrate, encapsulate etc. all the way to the ambient. The thermal capacitance / thermal resistance map of the junction-to-ambient heat-flow path, is a 1-D dynamic CTM that captures both the steady-state and transient thermal behavior of the package.
DURATION: 57 minutes
What You Will Learn
- Technology behind the T3Ster hardware
- How to use measurement data in CFD simulation software
- Use of T3Ster for component characterization
About the Presenter
Dr. John Parry, CEng. joined Mentor Graphics’ Mechanical Analysis Division (formerly Flomerics) in 1989 as the head of the Customer Services department. After four years, John moved to the Research department and he has been managing the division’s research activities since 1997.
Having published many technical papers over the years, John’s technical contributions include the development of compact thermal models for fans, heat sinks and chip packages. He is also a subject-matter expert in the application of Design of Experiment and optimization techniques.
John serves on several conference committees. He was the General Chair of SEMI-THERM 21 and currently represents the Mechanical Analysis Division in the JEDEC committee on thermal standards.
Who Should View
- Thermal Engineers
- IC Packaging Engineers
- Mechanical Engineers concerned with the thermal design of electronic products
- Managers wishing to learn how thermal measurements can identify problems and improve thermal design
Design and Engineering Consultancy, Voxdale, talk about why they use Computational Fluid Dynamics (CFD) as part of their design work flow. Examples of their work in the Process and Manufacturing Industries...…View On-demand Web Seminar
Electronics Cooling Simulation with FloTHERM XT: Step Change by Incorporating the EDA and MCAD Design Flows
45-minute web presentation introducing the new electronics cooling product from Mentor Graphics. See how FloTHERM XT can help you to make your whole design process a more streamlined and efficient process.…View On-demand Web Seminar
Other Related Resources
Success Story: Battery electric vehicles, or BEVs, not only allow for emission free traveling but are also capable of offsetting carbon dioxide emissions in the environment. While the most environmentally conscientious...…View Success Story
Success Story: HMS Albion and HMS Bulwark vessels had multiple pump and pipe work failures within the sea water fire mains. Engineers at Babcock Marine simulated real onboard operating line-ups using Flowmaster, ultimately...…View Success Story
White Paper: With every Kelvin increase in temperature, the risk of avionic component failure increases. For civil and military applications, the thermal characteristics of avionic components directly influence overall...…View White Paper