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Identifying Thermal Bottlenecks and Shortcut Opportunities

Details

Overview

Electronics thermal management involves the design of an electronics system to facilitate the effective removal of heat from the active surface of an integrated circuit (the heat source) out to a colder ambient surrounding.

As the heat travels from the source to the ambient it passes through various thermal bottlenecks. It also encounters areas where there are opportunities to insert new 'shortcut' heat flow paths. Identifying the locations and relative magnitudes of such thermal bottlenecks and shortcut opportunities as part of simulation post-processing will allow fewer and more effective thermal design modifications to be identified and implemented. This webinar will introduce the concepts involved and demonstrate a worked example.

What You Will Learn

This webinar will introduce the concepts involved in rerouting thermal bottlenecks through new heat flow paths, including:

  • A real-world example of the concept
  • "Design by Simulation" in electronics cooling

About the Presenter

Presenter Image Dr. Robin Bornoff

Robin achieved his Mechanical Engineering Degree from Brunel University in 1992. He was awarded his PhD from Brunel University in 1995 for CFD research. Robin joined Mentor Graphics Corporation, Mechanical Analysis Division (formerly Flomerics Ltd) after his PhD as an application and support engineer, specializing in the application of CFD to electronics cooling and the design of the built environment. He is now the Product Manager responsible for the FloTHERM, FloVENT and FloTHERM.PCBs software.

Who Should View

  • Mechanical Engineers
  • Engineers involved in thermal design
  • Engineers involved in electronics cooling designs
  • FloTHERM customers

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