Identifying Thermal Bottlenecks and Shortcut Opportunities

Overview

Electronics thermal management involves the design of an electronics system to facilitate the effective removal of heat from the active surface of an integrated circuit (the heat source) out to a colder ambient surrounding.

As the heat travels from the source to the ambient it passes through various thermal bottlenecks. It also encounters areas where there are opportunities to insert new 'shortcut' heat flow paths. Identifying the locations and relative magnitudes of such thermal bottlenecks and shortcut opportunities as part of simulation post-processing will allow fewer and more effective thermal design modifications to be identified and implemented. This webinar will introduce the concepts involved and demonstrate a worked example.

What You Will Learn

This webinar will introduce the concepts involved in rerouting thermal bottlenecks through new heat flow paths, including:

• A real-world example of the concept
• "Design by Simulation" in electronics cooling

Who Should View

• Mechanical Engineers
• Engineers involved in thermal design
• Engineers involved in electronics cooling designs
• FloTHERM customers