Using Measurement Data in Electronics Thermal Design - T3Ster CTM generation and detailed FloTHERM model calibration

Overview

This webinar will introduce the concept of structure functions and their derivation as well as presenting two ways in which experimental IC package studies can be effectively used in conjunction with numerical simulation.

Experimental transient testing techniques applied to IC packages produce ‘structure function’ type descriptions of the thermal resistances and capacitances the heat experiences as it passes from the die, through the package, on to the ambient. Such an approach is conducted using the T3Ster (transient thermal testing) measurement hardware and associated software processing tools. Beyond the insights into package construction and material properties it provides, structure functions can be used to derive compact thermal models (CTMs) of the package for subsequent use in simulations tools such as FloTHERM. In addition, a structure function based approach can be used to help calibrate a detailed 3D package simulation model for maximum accuracy.

What You Will Learn

• What structure functions are, how they are derived and what value they provide
• How T3Ster derived structure functions can be used to aid in the calibration of a detailed FloTHERM IC package model
• How T3Ster derived structure functions can be used to derive compact thermal models

Who Should View

• Thermal Engineers dealing in thermal testing, modeling and simulation
• Package Designers
• System Designers
• Application Designers

Related Industries

• Semiconductors