Using Measurement Data in Electronics Thermal Design - T3Ster CTM generation and detailed FloTHERM model calibration
On-demand Web Seminar
This webinar will introduce the concept of structure functions and their derivation as well as presenting two ways in which experimental IC package studies can be effectively used in conjunction with numerical simulation.
Experimental transient testing techniques applied to IC packages produce ‘structure function’ type descriptions of the thermal resistances and capacitances the heat experiences as it passes from the die, through the package, on to the ambient. Such an approach is conducted using the T3Ster (transient thermal testing) measurement hardware and associated software processing tools. Beyond the insights into package construction and material properties it provides, structure functions can be used to derive compact thermal models (CTMs) of the package for subsequent use in simulations tools such as FloTHERM. In addition, a structure function based approach can be used to help calibrate a detailed 3D package simulation model for maximum accuracy.
What You Will Learn
- What structure functions are, how they are derived and what value they provide
- How T3Ster derived structure functions can be used to aid in the calibration of a detailed FloTHERM IC package model
- How T3Ster derived structure functions can be used to derive compact thermal models
About the Presenter
Robin achieved his Mechanical Engineering Degree from Brunel University in 1992. He was awarded his PhD from Brunel University in 1995 for CFD research. Robin joined Mentor Graphics Corporation, Mechanical Analysis Division (formerly Flomerics Ltd) after his PhD as an application and support engineer, specializing in the application of CFD to electronics cooling and the design of the built environment. He is now the Product Manager responsible for the FloTHERM, FloVENT and FloTHERM.PCBs software.
Who Should View
- Thermal Engineers dealing in thermal testing, modeling and simulation
- Package Designers
- System Designers
- Application Designers
This webinar provides an up to date picture of the state of simulation driven design by sharing findings from a 2013 study. …View On-demand Web Seminar
In this webinar we will show how Flowmaster 1D system simulation software can help you quickly and easily design and characterize your plant's various cooling systems.…View On-demand Web Seminar
Other Related Resources
White Paper: The main source of heat in electronic equipment is their semiconductor chips, and the temperature sensitivities of these chips presents a challenge in designing cooling solutions. Overheating causes the...…View White Paper
White Paper: Why is Enclosure Thermal Design Important? Before we look at the 12 key considerations in enclosure thermal design let´s first consider why thermal issues need to be considered at the system, or enclosure...…View White Paper
White Paper: Many aspects of a PCB’s performance are determined during detailed design, e.g. making a trace a specific length for timing reasons. Timing issues are also affected by temperature differences between components....…View White Paper