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  • FloEFD™

    Award winning FloEFD. Embedded into major MCAD systems, FloEFD is a full-featured 3D fluid flow and heat transfer analysis simulation tool to help Design Engineers optimize product design and speed up their workflow. Better products, faster.

  • FloTHERM®

    FloTHERM® is a powerful 3D computational fluid dynamics software that predicts airflow and heat transfer in and around electronic equipment, including the coupled effects of conduction, convection and radiation.

  • FloTHERM® IC

    FloTHERM® IC is a web-based tool from Mentor Graphics that incorporates a high level of automation for key tasks related to semiconductor thermal characterization and design.


    FloTHERM PACK automates the creation of simulation-based semiconductor packages, thermal characterization, and the key tasks in semiconductor package design.


    FloTHERM PCB is a radical new collaboration tool for product marketing, electrical and mechanical engineers that accelerates the conceptual thermal design of printed-circuit boards.

  • FloTHERM® XT

    FloTHERM XT is an industry unique thermal simulation solution designed to be used during all stages of the electronics design process – from conceptual design to manufacturing, improving product quality, reliability and time-to-market.

  • FloVENT®

    FloVENT is a powerful Computational Fluid Dynamics (CFD) software that predicts 3D airflow, heat transfer, contamination distribution and comfort indices in and around buildings of all types and sizes.

  • Flowmaster®

    Flowmaster is a 1D general purpose CFD solution for thermo fluid system engineers to model and analyze the fluid mechanics and pipe flow in complex systems.

  • T3Ster

    MicReD’s flagship product, T3Ster®, is an advanced transient temperature measurement system which enables rapid and extremely accurate thermal characterization of semiconductor device packages or even complete electronic systems. A scalable solution, it offers the best price/performance ratio in the market.

  • T3Ster DynTIM

    T3Ster® DynTIM is a state-of-the art testing system for the automated measurement of the thermal conductivity of compressible thermal interface materials at variable thicknesses.

  • T3Ster TeraLED

    T3Ster® TeraLED® is a specialist solution for obtaining highly accurate measurements for power LEDs. It offers combined thermal and radiometric/photometric characterization of high-power LEDs, either in combination with T3Ster or as a stand-alone system.


2-1/2D mechanical drafting and documentation that connects multiple languages and netlist formats going to 3D solid modeling tools.

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