Sign In
Forgot Password?
Sign In | | Create Account

FloTHERM XT

Leading Innovation in Electronics Thermal Design

FloTHERM XT is an industry unique thermal simulation solution designed to be used during all stages of the electronics design process – from conceptual design to manufacturing, improving product quality, reliability and time-to-market. By bringing the EDA and the MCAD design flows closer, FloTHERM XT enables engineers to use the same design data throughout the design flow assuring the latest and most consistent data is always at the center of the design process.

Leveraging the electronic cooling DNA from FloTHERM and CFD technology from FloEFD, FloTHERM XT possesses the power and performance for large, complex electronic systems and provides unprecedented capabilities to both thermal experts and mechanical engineers. In comparison to traditional general-purpose simulation products, FloTHERM XT cuts process times significantly and enables designers and thermal specialists to quickly and efficiently arrive at an optimum solution.

Features and Benefits

  • Stand-alone software tool for electronics cooling simulation offers users specialized tool for solving large, complex electronics systems
  • CAD-centric user interface as well as geometry engine and controls enable users to become productive fast and with a very short learning curve
  • Full geometric and non-geometric SmartParts and Library capability enable users to access a full set of the most popular components for fast and accurate model creation
  • Single window application offers integrated solution progress and dynamic messaging windows
  • Supports direct interfaces with all major MCAD as well as Xpedition Enterprise EDA software for effortless and accurate data transfer

Highlights

Case 1 – Industrial Automation Example – Digital Potentiometer (Digipot) Digital potentiometers are typically used for trimming and scaling microcontroller analog signals. The enclosure protects a delicate PCB and the device relies on natural convection cooling.

Case 1 – Industrial Automation Example – Digital Potentiometer (Digipot)

Digital potentiometers are typically used for trimming and scaling microcontroller analog signals. The enclosure protects a delicate PCB and the device relies on natural convection cooling.

Case 1 – Industrial Automation Example – Digital Potentiometer (Digipot) A cross section cut-plane of the analyzed device shows an area of intense heat. Additional vents should be added to ensure cooling air reaches the affected components.

Case 1 – Industrial Automation Example – Digital Potentiometer (Digipot)

A cross section cut-plane of the analyzed device shows an area of intense heat. Additional vents should be added to ensure cooling air reaches the affected components.

Case 1 – Industrial Automation Example – Digital Potentiometer (Digipot) FloTHERM XT’s object-based mesher enables users to solve problems quickly without sacrificing accuracy.

Case 1 – Industrial Automation Example – Digital Potentiometer (Digipot)

FloTHERM XT’s object-based mesher enables users to solve problems quickly without sacrificing accuracy.

Case 1 – Industrial Automation Example – Digital Potentiometer (Digipot) The surface temperature plot can be used to assess whether the design has potential touch temperature problems on the system enclosure. 

Case 1 – Industrial Automation Example – Digital Potentiometer (Digipot)

The surface temperature plot can be used to assess whether the design has potential touch temperature problems on the system enclosure. 

Case 2 – Internet router Internet routers connect two or more computer networks. This model has been designed to be wall-mounted and the enclosed PCB was imported from Xpedition Enterprise. The enclosure is aesthetically designed with a curved front face and includes a number of ventilation holes to allow for natural convection cooling. It also includes a plate-fin heatsink with curved fins.

Case 2 – Internet router

Internet routers connect two or more computer networks. This model has been designed to be wall-mounted and the enclosed PCB was imported from Xpedition Enterprise. The enclosure is aesthetically designed with a curved front face and includes a number of ventilation holes to allow for natural convection cooling. It also includes a plate-fin heatsink with curved fins.

Case 2 – Internet router The surface temperatures on the PCB will quickly identify those devices which are non-compliant with thermal specifications.

Case 2 – Internet router

The surface temperatures on the PCB will quickly identify those devices which are non-compliant with thermal specifications.

Case 2 – Internet router Further understanding of the cooling performance can be made by examining the 3D flow field using the animated particle post-processing feature.

Case 2 – Internet router

Further understanding of the cooling performance can be made by examining the 3D flow field using the animated particle post-processing feature.

Case 3 – Smartphone External flow field for a natural convection analysis of a smartphone.

Case 3 – Smartphone

External flow field for a natural convection analysis of a smartphone.

Case 3 – Smartphone Surface temperatures and cut-planes can also be used to make an assessment of whether the touch screen will perform correctly 

Case 3 – Smartphone

Surface temperatures and cut-planes can also be used to make an assessment of whether the touch screen will perform correctly 

Case 3 – Smartphone Varying the color maps and positioning of the geometry can help to further clarify any design issues.  In this image, we are looking in detail at the external flow field and the surface temperatures on the back casing of the smartphone.

Case 3 – Smartphone

Varying the color maps and positioning of the geometry can help to further clarify any design issues. In this image, we are looking in detail at the external flow field and the surface temperatures on the back casing of the smartphone.

Case 4 – Graphics card with angled geometry High-end graphics cards require novel cooling solutions – in this case, a heatsink with curved geometry has been designed to fit the enclosure.

Case 4 – Graphics card with angled geometry

High-end graphics cards require novel cooling solutions – in this case, a heatsink with curved geometry has been designed to fit the enclosure.

Case 4 – Graphics card with angled geometry Surface temperatures and 3D particle plots can be used to assess the effectiveness of the new heatsink design.

Case 4 – Graphics card with angled geometry

Surface temperatures and 3D particle plots can be used to assess the effectiveness of the new heatsink design.

Case 5 – Automotive pump controller Solid model of an automotive pump controller from several angles. There are a few interesting components namely the induction coil tightly packed together. Meshing this geometry for most general-purpose simulation software can be quite a challenge!

Case 5 – Automotive pump controller

Solid model of an automotive pump controller from several angles. There are a few interesting components namely the induction coil tightly packed together. Meshing this geometry for most general-purpose simulation software can be quite a challenge!

Case 5 – Automotive pump controller Surface temperatures on the key components and the induction coil will show whether the critical devices are within operating constraints.

Case 5 – Automotive pump controller

Surface temperatures on the key components and the induction coil will show whether the critical devices are within operating constraints.

Case 5 – Automotive pump controller Examination of the flow-field complexity using the 3D particle post-processing option will help to identify where re-circulations might be causing a design issue.

Case 5 – Automotive pump controller

Examination of the flow-field complexity using the 3D particle post-processing option will help to identify where re-circulations might be causing a design issue.

Industry Applications

System Requirements

Supported Operating Systems

  • Microsoft Windows XP Professional x64 Edition latest SP.
  • Microsoft Windows 7 Professional, Ultimate or Enterprise 64-bit edition latest SP.

Hardware and OS Requirements

  • x64 compatible PC
  • Ethernet network adapter
  • Mouse or other pointing device
  • DVD-ROM drive
  • 1024 MB RAM minimum, more recommended
  • Graphics card with OpenGL support minimum 64 MB memory and minimum XGA screen resolution (1024 x 768)
  • Microsoft Office 2003 latest SP; Microsoft Office 2007 latest SP; Microsoft Office 2010 latest SP
  • Microsoft Windows Media Player 7.0 or higher
  • Minimum disk space requirements: 9 GB, which includes space necessary during installation and when modifying an existing installation. Note that 4 GB is always required on the default drive (C:\ or equivalent) whether installing to the default drive or a non-default drive
  • For a FLEX-Only 32-bit installation, 100 MB, which includes space necessary during installation and when modifying an existing installation
 
Online Chat