FloTHERM

Proven, industry-leading CFD software for Electronics Cooling applications from the thermal analysis leaders.

FloTHERM® is powerful 3D computational fluid dynamics (CFD) software that predicts airflow and heat transfer in and around electronic equipment, from components and boards up to complete systems.

World leader in thermal analysis

FloTHERM enables engineers to create virtual models of electronic equipment, perform thermal analysis, and test design modifications quickly and easily before any physical prototypes are built.

FloTHERM uses advanced CFD techniques to predict airflow, temperature, and heat transfer in components, boards, and complete systems.

With a 98% user recommendation rating, FloTHERM is the undisputed world leader for electronics thermal analysis and has more users, application examples, libraries and published white papers than all others.

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Heatsink 101: Everything You Ever Wanted To Know

This web seminar will focus on how heatsinks work and how to design a heatsink while considering all the critical factors such as size, airflow, cost and attachment methods. View Video

Features and Benefits

Feature:Intelligent Thermal Models

Intelligent Thermal Models

Models that range in scale from single ICs on a PCB to full racks of electronics are assembled quickly from a complete set of SmartParts (intelligent model creation macros) that are supplied with FloTHERM from a large list of suppliers from around the globe. SmartParts capture modeling expertise to streamline model creation, minimize solve times and maximize solution accuracy.

Thermo Electric Cooler (TEC) SmartPart functionality is also supported by FloTHERM. By adding a TEC you can control the temperature so the specified component doesn’t get hotter than the predefined maximum for your design. Also, the Fan RPM Derating feature supports the operation of an electronic device at less than its rated maximum power while taking into consideration the case or body temperature, ambient temperature and the type of cooling mechanism used.

Feature:MCAD and EDA Integration

MCAD and EDA Integration

FloTHERM features the industry’s best solution for integration with MCAD and EDA software. Native data from Pro/ENGINEER, SolidWorks, CATIA and other MCAD and EDA software can be imported into FloTHERM. Unlike other thermal analysis software, FloTHERM automatically prepares the geometry for efficient and accurate analysis.

EDA interfacing is achieved by import of the IDF format as well as direct interfaces to Expedition PCB, BoardStation, Allegro and CR5000.

Feature:Cartesian Mesher

Use of a Robust Structured Cartesian Mesher Minimizes Solution Time

The FloTHERM grid is based on a structured-Cartesian method -- the most stable and numerically efficient type of grid available. The ability to localize the grid is also included for finer resolution where it is needed, minimizing solution time and improving accuracy in grid quality. The grid in FloTHERM is associated with SmartParts and is generated as part of the model assembly process with refinement under user control. This intuitive and straightforward methodology enables engineers to focus on design rather than analysis. Gridding is instantaneous and reliable in FloTHERM in comparison to other tools that require significant time and expertise to master. Finally, FloTHERM is the only analysis software with object-associated grid that eliminates re-gridding for each model modification.

Feature:Automatic Optimization

Automatic Optimization

SmartPart-based modeling and structured cartesian grid enable a feature called “automatic sequential optimization” that is unique to FloTHERM. This allows users to specify a design goal and then let FloTHERM do the hard work of finding the right combination of design variables that meet the goal. Common applications of this feature include optimization for heatsink design, PCB component placement, fan/blower selection and other common design scenarios.

Automatic sequential optimization enables engineers to find design margin or production cost savings that were impractical in the past. As an alternative to automatic sequential optimization, a design of experiments (DoE) can be constructed that will automatically analyze the full range of all possible combinations of parametric variations. These models can be solved on a distributed network of computers using the unique “Volunteer” solution technology.

Feature:Finely-tuned Solver

Finely-tuned Solver

For over 15 years, the FloTHERM solver has specifically addressed electronics cooling applications. The solver results in the most accurate results possible and offers the fastest solution time per grid cell. Massive disparity in geometric length scales are resolved using the unique ‘localized-grid’ technique, which allows for integrally matched, nested, non-conformal grid interfaces between different parts of the solution domain.

The conjugate nature of heat transfer within electronic systems is concurrently solved using a preconditioned conjugate residual solver together with a flexible cycle multi-grid solution technique. Pragmatic, unique and accurate solution termination criteria produce useful results in engineering, not academic, time scales.

Feature:Powerful Visualization Tools

Powerful Visualization Tools

The FloTHERM visualization toolset is developed specifically to maximize productivity for sharing the results of your design and analysis for your electronics cooling projects. Fully rendered models, 3D flow animation and tools for dynamic manipulation of temperature, and flow results, enable engineers to pinpoint thermal issues and visualize design improvements quickly and effectively. Texture mapping and AVI output enable communication of thermal-design concepts with non-technical colleagues. Most recently thermal Bottleneck (Bn) and Shortcut (Sc) post processing parameters have been added to allow engineers to visualize existing thermal bottlenecks and any opportunities to insert a new heat flow path in order to shortcut the heat to cooler areas.

A complimentary, full-functional version of the post-processor which can be used for easy “off-site” results presentation is available with the FloVIZ Viewer.

From the blogs

Bottlenecks and Interface Materials; Part 3 – Relieving Thermal Bottlenecks Reduce Temperatures

Robin Bornoff's blog

blog post: As with all good inventions, you quickly wonder how on earth you could have done without them before. Relieving thermal bottlenecks reduce temperatures; it’s so blindingly obvious. Now that we have…View Blog Post

Bottlenecks and Interface Materials; Part 2 - When TIMs Go Bad

Robin Bornoff's blog

blog post: ‘Bits stuck onto other bits’, a succinct definition of an electronic product, if not a product that contains electronics. Soldering is the method of choice for getting the components to attach…View Blog Post

Bridging the Simulation Supply Chain; NXP Semiconductors, a Case in Point

Robin Bornoff's blog

blog post: By far and away the most common enquiry by someone using FloTHERM, especially at the start of their adoption, is “How do I model my components?”. This is hardly surprising as the mainstay of electronics…View Blog Post

Best Product Award

FloTHERM, wins 2011 Design News Golden Mousetrap award for Best Design Tools Product.
Read more

Mentor Graphics Concurrent CFD analysis software FloTHERM, wins 2010 EDN award for Best Product.
Read more

Success Stories

Valeo

Valeo uses FloTHERM® to quickly and accurately ensure the reliability of an electronic motor control unit governing the speed of an engine-cooling fan. View

Applied Micro Circuits Corporation

Thermal Simulation Reduces IC Cost by Comparing Flip-Chip/Wire Bond Thermal Performance AMCC’s new integrated circuit achieves the highest performance to price ratio of any product in its class thanks to FloTHERM® thermal simulation software. View

Industry Applications

Unlike other thermal simulation software, FloTHERM is an industry-specific thermal analysis tool designed for a wide range of electronic applications such as:

System Requirements for V9

Microsoft Windows, 32-bit editions

Supported operating systems

  • Windows Vista (Business, Enterprise and Ultimate editions) with SP 1
  • Windows 2000 Professional with SP 4
  • Windows XP Professional with SP 2
  • Windows Server 2003, Standard and Enterprise editions with SP1& 2

Hardware requirements:

  • x86-compatible Intel or AMD processor, minimum 1GHz Pentium III
  • 512 MB system memory (RAM), 1 GB recommended
  • Graphics card with OpenGL support, minimum 64 MB memory and minimum XGA screen resolution (1024 x 768)

Microsoft Windows, 64-bit editions

Supported operating systems:

  • Windows Vista (Business, Enterprise and Ultimate editions) with SP 1
  • Windows XP Professional x64 edition with SP 1
  • Windows Server 2003 x64 editions (Standard and Enterprise) with SP 1

Hardware requirements:

  • 64-bit capable AMD processor or an Intel processor with EM64T
  • 512 MB system memory (RAM), 1 GB recommended
  • Graphics card with OpenGL support minimum 64 MB memory and minimum XGA screen resolution (1024 x 768)

Linux, 32 bit (x86)

Supported operating systems:

  • Red Hat Enterprise Linux 4

Hardware requirements:

  • x86-compatible processor
  • 512 MB system memory (RAM), 1 GB recommended

Linux, 64 bit (x64)

Supported operating systems:

  • Red Hat Enterprise Linux 4 (32 bit support)

Hardware requirements:

  • x86-compatible processor
  • 512 MB system memory (RAM), 1 GB recommended

Sun Solaris

Supported operating systems:

  • Sun Solaris 9 (SPARC) with 09/05
  • Sun Solaris 10 (SPARC) with 01/06 or higher

Hardware requirements:

  • 400 MHz Ultra SPARC-II processor or higher
  • 512 MB system memory (RAM), 1 GB recommended
  • Graphics card with OpenGL support minimum 64 MB memory and minimum XGA screen resolution (1024 x 768)