Mentor.com :: Mechanical Analysis Resources

News Article:Mentor Graphics Andras Poppe Recognized by JEDEC Standards Organization for Contributing to the Development of the JESD51-5x Series of Global Thermal Testing Standards for Light-Emitting Diodes (LEDs)

Fri, 31 May 2013 13:00:00 GMT

WILSONVILLE, Ore., May 31, 2013—Mentor Graphics Corporation (NASDAQ: MENT) today announced that Dr. Andras Poppe of Mentor Graphics and the Budapest University of Technology has been recognized by the JEDEC international standards organization for his significant contributions to the JESD51-5x series of thermal testing standards for Light-Emitting Diodes (LEDs).

Event:Introduction to DynTIM

Tue, 28 May 2013 07:00:00 GMT

A complimentary on-line web seminar on how and why to use the new DynTIM product from Mentor Graphics.

News Article:Mentor Graphics Yafei Luo Receives International Conference on Electronics Packaging (ICEP) Young Award from IEEE Components Packaging & Manufacturing Technology Society

Fri, 24 May 2013 13:00:00 GMT

TOKYO, Japan, May 24, 2013 —Mentor Graphics Corporation (NASDAQ: MENT) today announced that Yafei Luo, senior application engineer for the Mentor Graphics® Mechanical Analysis Division, has received the International Conference on Electronics Packaging (ICEP) Young Award. ICEP is Japan’s only international conference on electronics packaging, and the award is sponsored by the IEEE Components, Packaging and Manufacturing Technology (CPMT) Society of Japan for young researchers under the age of 35.

On-demand Web Seminar:Voxdale: Virtual Prototyping for the Process and Manufacturing Industries

Wed, 15 May 2013 17:41:39 GMT

Design and Engineering Consultancy, Voxdale, talk about why they use Computational Fluid Dynamics (CFD) as part of their design work flow. Examples of their work in the Process and Manufacturing Industries will also be shown.

Blog Post:Why Not Just Shove a Heatsink on Top of it? Part 2: Heat Flow Budgets

Robin Bornoff — Wed, 15 May 2013 15:33:45 GMT

Two different package styles, two very different thermal responses when a extruded plate fin heatsink is placed on each. At the very least a FloTHERM simulation can be used to observe the thermal behaviour of a product concept, beyond that it can be used to understand *why* the thermal behaviour is what it is. In Part 1 we saw that the BGA type package benefited from an 81% drop of junction temperature

Success Story:Babcock Marine

Wed, 15 May 2013 07:00:00 GMT

HMS Albion and HMS Bulwark vessels had multiple pump and pipe work failures within the sea water fire mains. Engineers at Babcock Marine simulated real onboard operating line-ups using Flowmaster, ultimately enabling them to recommend design improvements to reduce any further component failures.

Success Story:University of Stuttgart

Wed, 15 May 2013 07:00:00 GMT

Battery electric vehicles, or BEVs, not only allow for emission free traveling but are also capable of offsetting carbon dioxide emissions in the environment. While the most environmentally conscientious drivers are happy to do their duty to protect and preserve the climate, this cannot come at the detriment of speed, endurance, and comfort.

Blog Post:Why Not Just Shove a Heatsink on Top of it? Part 1

Robin Bornoff — Mon, 13 May 2013 08:36:43 GMT

A common enough question. Heatsinks are often perceived to be the magic answer to all electronics cooling challenges. They should be called ‘area extenders’ as heat does not just disappear into them. Heat spreads throughout a heatsink passing to the air over a much larger area than it would otherwise do. Air can then do its magic, whisking the heat away thus keeping the electronics that

On-demand Web Seminar:Electronics Cooling Simulation with FloTHERM XT: Step Change by Incorporating the EDA and MCAD Design Flows

Wed, 08 May 2013 17:56:30 GMT

45-minute web presentation introducing the new electronics cooling product from Mentor Graphics. See how FloTHERM XT can help you to make your whole design process a more streamlined and efficient process.

White Paper:Tackling the Thermal Design Challenges of Smaller, Lighter, and More Efficient Avionics

Mon, 06 May 2013 15:00:00 GMT

With every Kelvin increase in temperature, the risk of avionic component failure increases. For civil and military applications, the thermal characteristics of avionic components directly influence overall thermal management. They dictate the size, weight, and power (SWaP) of the cooling and therefore the overall system and can decide between function and failure. Commercial off-the-shelf components for avionic systems may cost less, but the lower price has to be weighed against SWaP and reliability to ensure the whole cooling system is viable.