T3Ster
Advanced thermal tester for packaged ICs
T3Ster® (pronounced "Trister") is an advanced thermal tester semiconductor package for thermal characterization, producing a complete package thermal characterization in just a few minutes.
Dynamic Thermal Characterization
T3Ster is aimed at dynamic thermal characterization of packaged semiconductor devices (diodes, BJT-s, J-FET-s and MOSFET-s, thyristors, power LED-s), MCM-s and other electrical or MEMS components. With dedicated fixtures and software, characterization of PWB-s and other substrates or thermal interface materials and/or cooling assemblies is also possible.
Options and Accessories
T3Sster has a wide range of add-on options that provide flexibility in daily thermal measurement and characterization work, for example:
- Automated device calibration with our dry thermostat and a couple of supported liquid-cooled thermostats
- Easy connection of any type of thermocouples through the appropriate preamplifiers
- Increased level of switched power with the different booster options
- Addition of the TERALED unit for high-power LED measurement
Features and Benefits
Benefits
- Provides the best figure of merit available on the market
- Measures the thermal transient in real-time, without any compromise
- Properly measure devices - like power LEDs - that other equipment can not
- Die attach failures are easily located in stacked die packages using structure functions
- Field service maintenance
- Measurement consulting services are available
Features
- Scalable equipment, hardware and software add-on options
- Fixtures for special measurements such as thermal interface material (TIM) or characterization, effective board thermal conductivity measurement
- JEDEC compliant thermal resistance measurements and dynamic characterization
- Heat-flow path details
- Measurement control even from your notebook computer
- Continuous development, solid scientific background & consulting services
“To reliably measure the interface resistance we needed a transient measuring method. We chose the T3Ster® because of its compactness and ease of use, allowing us to improve data acquisition and processing of the transient thermal data. We were able to improve the accuracy of TIM measurements and measure the contribution of the different components – the heater chip, thermal interface, cooling cap, second interface, and heat sink.”
Dr. Bruno Michel, Advanced Thermal Packaging Manager at IBM Zurich Research Library
Datasheet
- T3Ster (PDF, 2mb)
- T3Ster - Better LED Design (PDF, 202kb)
Toolbox
T3Ster Validation of Thermal Models of IC Packages
Learn how Thermal Transient Tester (T3Ster) equipment can be used to generate Compact Thermal Models (CTMs) for use in thermal design to improve junction temperature prediction. View On-demand Web Seminar
Contact Mentor Graphics
- T3Ster® Info Request or call toll free: 1-800-547-3000