This paper investigates the limits of natural methods of electronics cooling to regulate computer temperature. Fluid flow simulation of sealed and vented enclosures was performed using FloTHERM thermal modeling software. This CFD analysis determines how current cooling technologies can expose the factors that create and reduce bottlenecks to effective heat transfer.

The paper also discusses how the increasing power density of electronics enclosures is leading to a greater focus on thermal management of these enclosures. Some industries trying to stay away from forced convection solutions are reaching the limits of natural convection solutions, while others have already passed this limit and are forced to use mechanical means for electronics cooling, which has its drawbacks.