Structure Function – The Bridge of Thermal Measurement and Thermal Simulation

ABSTRACT

Now a days thermal simulator like FloTHERM is capable to run 3D thermal simulation with high accuracy. However, in order to achieve result matching the really world physically matched thermal model is also an essential factor. Structure Function - the key technology of Mentor Graphics product T3Ster, enables user to verify thermal simulation model against physical device. It also provides a way to measure thermal properties of electronics packages such as thermal conductivity of the metal layer in a TO220 package, or thermal conductivity of TIM materials or grease.