Structure Function – The Bridge of Thermal Measurement and Thermal Simulation
White Paper
ABSTRACT
Now a days thermal simulator like FloTHERM is capable to run 3D thermal simulation with high accuracy. However, in order to achieve result matching the really world physically matched thermal model is also an essential factor. Structure Function - the key technology of Mentor Graphics product T3Ster, enables user to verify thermal simulation model against physical device. It also provides a way to measure thermal properties of electronics packages such as thermal conductivity of the metal layer in a TO220 package, or thermal conductivity of TIM materials or grease.
Related Resources
Introduction to Thermal Simulation of Electronics
On-demand Web Seminar 17:48Introduction to Thermal Simulation of Electronics
An introduction to why Thermal Analysis is so important in the design of Electronic Products, and why CFD is used in the design process to save time and money.
Hand-Tied to Profitability - Conducting CFD During...
On-demand Web Seminar 22:40Hand-Tied to Profitability - Conducting CFD During Product Development in a Tough Economy
Computational Fluid Dynamics is at a crossroads where it is more readily adopted yet is not a disruptive risk. Join us for this webinar as Chad Jackson talks about this new opportunity to change the equation...
Continental Automotive GmbH
Success StoryContinental Automotive GmbH
Designing automotive multimedia systems to operate under a wide range of environmental conditions requires much more than physical prototyping after the design is complete. Find out how Continental engineers...