The Development of Libraries of Physical Models of Electrical Components for an Integrated Design Environment
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ABSTRACT
This paper describes a 3-year European collaborative project, named DELPHI, whose goal was to address the lack of reliable, standardized input data needed to accurately predict the operating temperatures of critical electronic parts at the component-, board and system-level.
It includes a review of legacy methods for the thermal characterization of component packages with special emphasis on mono-chip packages.
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