Thermal Transient Modeling and Experimental Validation in the European Project PROFIT
White Paper
ABSTRACT
This paper presents the results of the European project PROFIT. Sixteen different packages from the three Semiconductor Manufacturers: Infineon, Philips and ST Microelectronics were measured in four Dual Cold Plate (DCP) environments as defined in the preceding DELPHI and SEED projects. TO-type and fine pitch measurement for the DCP-4 boundary condition and interface resistance reduction using Wood’s alloy are demonstrated.
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