NXP Semiconductors

NXP Semiconductors used T3Ster and the related results evaluation software to quickly and easily characterize and validate their dynamic compact thermal models (DCTMs) of chip packages.

“In our lab today the T3Ster is mainly used to measure the thermal resistance of our packages in customer-specific environments. Thanks to the T3Ster, these measurements are very quick and easy to perform. With the help of the T3Ster-Master software we are not only able to give customers strong confidence that our compact thermal models are correct, but also give them insights into how the heat can be dissipated to the environment and the impact of possible faults that may occur during board assembly. Furthermore, for determining the properties of SOI materials, we also measure special test chips with T3Ster, yielding reliable data for thermal simulations of our own SOI chips. T3Ster is a highly versatile piece of equipment. I am sure that we will find other application areas in the near future.”

The chip package design challenge

End-users of chip packages need reliable, calibrated thermal models from semiconductor manufacturers in order to predict junction temperatures accurately and ensure proper cooling of the package in the end-user application. Recently, customers have been demanding Dynamic Compact Thermal Models (DCTMs) which are capable of predicting both steady-state and transient thermal behavior in chip packages.

T3Ster is chosen to measure thermal transient response of packages

The T3Ster is a piece of test and measurement equipment designed specifically to measure the transient thermal response of a package quickly and simply. NXP based its decision to purchase the T3Ster on its high measurement accuracy, 1 micro-second time resolution, and high signal-to-noise ratio, making it the best thermal characterization equipment available on the market, especially for transient measurements. The compact thermal models are validated by comparing the model predictions against the T3Ster measurements.

T3Ster is used to validate models

NXP has now gained a very high level of confidence in its ability to create compact thermal models that closely match the part’s actual thermal behavior under real operating conditions. T3Ster measurements are used to confirm that the material property values used during the model creation are correct. To date, NXP has developed models for more than three hundred of its own chip packages.