Osram Opto Semiconductors GmbH

Osram have tested a large number of samples with T3Ster to provide a full radiometric characterization of the LED.

“As LEDs become more powerful, more attention should be paid to thermal management, which is essential to ensure stable LED performance and long lifetime. This is why OSRAM is devoting considerable attention to thermal design. T3Ster's accuracy and repeatability enable us to verify our thermal designs and confirm the stability and reliability of our products. By testing in bulk we get increased statistical confidence in the measurement results. The structure functions built into the T3Ster software are extremely powerful for identifying different thermal attach issues during our extensive reliability testing.”

LED package design challenges

To achieve highly efficient light output having the required photometric, colorimetric and radiometric characteristics, coupled with effective removal of the generated heat is not an easy task. LEDs need to operate at much lower temperatures to ensure high light output and quality, so the LED package's thermal performance is critical: good conductive cooling through multiple thermal interfaces has to be provided in a stable, reliable product.

T3Ster and TeraLED provide full radiometric characterization of LEDs

To obtain exact thermal metrics that correctly account for the emitted optical power, T3Ster can be combined with the TeraLED system to provide a full radiometric characterization of the LED during the thermal transient testing. All thermal interfaces in the heat flow path can be precisely quantified including the LED die-attach.

T3Ster measurements verified with acoustic microscopy

Osram have tested a large number of samples with T3Ster and used acoustic microscopy to verify T3Ster's measurement capabilities.