Buried Capacitance Materials for Power Integrity

For everyone using the new HyperLynx PI tool, here is a list of available PCB Laminates that are candidates for the PWR/GND pair in your stackup.  This table is from page 217 (Fig 32) of my HDI HANDBOOK.   The entire Chapter 5 is about “Materials for HDI” and you might find it interesting.

Some of the abbreviation used in the Table are: CCL=copper clad laminate; film=copper clad unreinforced polyimide film; Prepreg=epoxy fiber-glass coated b-stage material for lamination; RCF=resin coated copper foil; Sequential lam=the material requires some processing (one side etched) and lamination before it can be used; Both sides etching=the copper for PWR and GND can be etched and then the material laminated in to the stackup.

materials4


Preparing Recommendations

About Happy Holden

imageThis is my 40th year in electronics and especially printed circuits. From 1968, when I first started and an IC Process Engineer for Hewlett-Packard, my first 10 years at HP took me into PCB Chemical Engineering and Engr. Mgmt., then 10 years in Asia for HP working on Application Software, to my final 8 years at HP being the PCB R&D Mgr. for boards and packaging. After retiring from HP, I ran my own Consulting COmpany for 10 years until being hired by one of my clients, Mentor Graphics. Being at Mentor Graphics since the fall of 2006, I now focus on Advanced PCB Technologies, both for consulting and for new Mentor products. High Density Interconnects )(HDI) is one of those advanced technologies, as well as Flex-Rigid, 3D Packaging (SiP) , photonics (waveguides) and now MEMS and MicroFluidics. Visit Happy Holden's Blog

More Posts by Happy Holden

More Blog Posts

Preparing Recommendations

Comments

No one has commented yet on this post. Be the first to comment below.

Add Your Comment

Please complete the following information to comment or sign in.

(Your email will not be published)