New Chapters for the HDI HANDBOOK

New Chapters for the HDI HANDBOOK

Hopefully, you have taken the opportunity to download my free E-book, the HDI HANDBOOK. NOW is your chance to tell me what would make interesting reading for FUTURE chapters in the SECOND EDITION of the HDI Handbook. Here are some brief descriptions of what I am planning to add now. But this book isn’t for me - it’s for ALL of you! So provide me with some advice and if you know the perfect expert that could write that chapter, throw that in as well. I thank you all now for helping me. The Second Edition will be available for download on Jan. 3, 2010.

1. Automatic Chemical Process Monitoring and Control - High-speed PCB and FPC manufacturing with increasing density requires better chemical control of processes. This chapter will describe traditional instrumental and some not-so-standard methods of automatic chemical analysis and control. The PCB processes, individual anion and cations and other indicators are highlighted for control.
2. Process Automation Strategies and Equipment - Complementing high-speed manufacturing is high-speed automated equipment. This is the first time that 10 different types of automated PCB equipemnt has been described and features. Conveyorized: horizontal, vertical, overhead and hybrid; Process Tanks: walking beam, cable, split-rail pusher and side-arm return-type; Programmed Hoists: cantelevered and gantry. Control systems, programming hoists, simplified control theory and automation strategies are also described.
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3. Design Methodologies for Creating Proper Split Power Planes - Plane design methodology to eliminate noise problems. How you need to change the design perspective of PDNs. The PCB design setup for: Connecting to the plane, plane shapes, Do’s and Don’ts to be considered, plane “Routing” strategies for fanout power vias. Evaluating plane integrity, consideration of decoupling capacitors and buried capacitance. Power Supply checklist, new IPC standards for current carrying and deficiencies in CAD tools today.
4. Impedance, Stackups and Crosstalk - A complete look at signal tracts to transfer signal power from one device to another by consideration of materials, stackups, impedance matching and crosstalk. The various high-speed models for microstrips and stripline, of differential signalling, with coplanar and waveguide alternatives are explained. Advanced noise explanation of crostalk are also explained.
5. BGA Breakout Strategies - Charles Pfeil of Mentor has agreed to write a chapter that summarizes his theories and book on ” BGA Breakout and Routing-ED II”. His new technique for breakout of large BGAs has revolutionised the wiring of boards. It was highlighter in Chapter 3, but in only 4 pages- now it will be explained in a lot more detail.
6. Coupons and Techniques for Process Control - Ron Rhodes had a distinguished carreer at Bell Labs and will provide a chapter on the use of PCB coupons to highlight quality and process capability. Reliability is another set of coupons and have a different focus. How to interpret and “what these coupons mean” is another distinguished topics that Ron created by writing a column in CircuiTree magazine from 1994 to 2007.

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