Buried Capacitance Materials for Power Integrity
For everyone using the new HyperLynx PI tool, here is a list of available PCB Laminates that are candidates for the PWR/GND pair in your stackup. This table is from page 217 (Fig 32) of my HDI HANDBOOK. The entire Chapter 5 is about “Materials for HDI” and you might find it interesting.
Some of the abbreviation used in the Table are: CCL=copper clad laminate; film=copper clad unreinforced polyimide … Read More
Tags: PCB_mfg, PCB_Laminate, HDI_Design, PCB_Manufacturing, HDI, Laminate, PCB_Design, FR4