Stackups: More than just a bunch of routing layers
Proper stackup design is the key to ensuring maximum performance for your PCB design. Electromagnetic compatibility, signal integrity, power integrity - even proper thermal performance - can all be ensured with the proper stackup design. Given the high route density of most boards nowadays, you try to pack as many routing layers as possible into a given thickness. For most large-scale consumer products, … Read More
Tags: Expedition, HyperLynx, EMC, Signal Integrity, stackup, layers, Power Integrity