6
Mar, 2012
Interconnect loss modeling? Check.
Signal conditioning modeling? Check.
Ability to simulate multiple S-parameter models for things like connectors and packages and vias correctly in the time domain? Oooh…. that’s a tough one. Check!
Ability to include all sources of deterministic and random jitter, worst-case bit patterns, and worst-case crosstalk in the analysis? Wow! Check.
3D … Read More