HyperLynx 3D EM
Electromagnetic Design & Verification for PCB & Packaging
HyperLynx 3D EM from Mentor Graphics is a high-capacity electromagnetic design and post-layout verification solution for today’s PCB, packaging, RFIC, MMIC, and planar antenna designs.
HyperLynx 3D EM has native integration with HyperLynx BoardSim and Expedition PCB, which allows SI/PI engineers to effortlessly select and import target geometries from a layout for 3D geometry modeling and EM simulation. The automatic 3D model creation provides full support for bond wires, solder balls and bumps, complex via structures, interconnect, and dielectric thicknesses. The proprietary non-uniform mesh generation and adaptive curve fitting ensure fast and accurate simulation results for these types of applications. For RFIC, MMIC, and antenna design flows, HyperLynx 3D EM can import a wide variety of third-party and industry-standard data formats including GDSII, AutoCad DXF, Gerber, SAT and others.
Increase design flexibility and decrease costs
Designers are no longer required to carefully manually partition the design to simplify and/or reduce the size of the structure to fit the available memory footprint. With the high design capacity of HyperLynx 3D EM risk associated with design partitioning is mitigated and time-consuming designer intervention is eliminated, thereby reducing time-to-simulated results for large-structure EM simulation.
Employing HyperLynx 3D EM accelerates EM design closure by supporting multi-core and distributed simulation with a single unique flexible EM engine license. The designer chooses the combination of EM engines that best match their simulation needs and available hardware. As part of EM simulation launch setup, the designer configures the number of EM engines and number of CPU cores each engine will utilize and whether the engine will be used as a distributed simulation engine or multi-sim engine. This licensing approach reduces EM tool cost by achieving high engine utilization and accelerates EM design closure with increased simulation throughput.
- Powered by a proven 3D full-wave EM engine to ensure accurate results
- High-capacity EM engine eliminates missing hard-to-detect EM coupling design flaws
- Easy to use one-click layout-to-EM Model from Mentor BoardSim and Expedition
- Combine multiple engines to increase simulation throughput and accelerate EM design closure
HyperLynx 3D EM Tools
The HyperLynx 3D EM engine offers a flexible architecture enabling the user to configure the best match to their needs at launch time. The EM engine can be configured in either a distributed- or multi-simulation mode depending on the hardware computing environment.
HyperLynx 3D EM Designer
HyperLynx 3D EM Designer is the user interface equipped to create a full 3E geometry model directly from BoardSim or Expedition. The Designer provides geometry editing, port definition, and simulation job launch and management facilities to maximize tool access and throughput.
HyperLynx 3D EM SSD is ideally suited for designing monolithic microwave integrated circuits (MMICs), radio-frequency integrated circuits (RFICs), low-temperature co-fired ceramic (LTCC) circuits, high-temperature superconducting (HTS) circuits, radio-frequency identification (RFID) antennas, patch antennas, slot antennas, wire antennas, and most other RF and wireless antennas.