HyperLynx 3D EM

Electromagnetic Design & Verification for PCB & Packaging

HyperLynx 3D EM from Mentor Graphics is a high-capacity electromagnetic design and post-layout verification solution for today’s PCB, packaging, RFIC, MMIC, and planar antenna designs.

Challenges

Today’s multi-gigabit PCB and package designs must take into account an increasing number of previously ignorable electrical effects. For high speed data paths, every trace, bump, bend, turn, layer transition requires an accurate electrical model for signal integrity and power integrity (SI/PI) analysis. Non-intended and non-ideal characteristics such as transmission-line propagation, signal delay and attenuation, finite impedance of conductors, metal planes, and power-supply structures can induce interference and crosstalk problems. Other issues that can arise on high-speed PCB designs include discontinuities due to imperfect interconnects (such as power/ground inductance), unintended current-paths, signal crosstalk and noise immunity must be considered during the design phase and verified post-layout.

Native integration

HyperLynx 3D EM has native integration with HyperLynx BoardSim and Expedition PCB, which allows SI/PI engineers to effortlessly select and import target geometries from a layout for 3D geometry modeling and EM simulation. The automatic 3D model creation provides full support for bond wires, solder balls and bumps, complex via structures, interconnect, and dielectric thicknesses. The proprietary non-uniform mesh generation and adaptive curve fitting ensure fast and accurate simulation results for these types of applications. For RFIC, MMIC, and antenna design flows, HyperLynx 3D EM can import a wide variety of third-party and industry-standard data formats including GDSII, AutoCad DXF, Gerber, SAT and others.

Increase design flexibility and decrease costs

HyperLynx 3D EM provides accurate full wave solutions for complex 3D structures on packages and printed circuit boards.

Designers are no longer required to carefully manually partition the design to simplify and/or reduce the size of the structure to fit the available memory footprint. With the high design capacity of HyperLynx 3D EM risk associated with design partitioning is mitigated and time-consuming designer intervention is eliminated, thereby reducing time-to-simulated results for large-structure EM simulation.

Employing HyperLynx 3D EM accelerates EM design closure by supporting multi-core and distributed simulation with a single unique flexible EM engine license. The designer chooses the combination of EM engines that best match their simulation needs and available hardware. As part of EM simulation launch setup, the designer configures the number of EM engines and number of CPU cores each engine will utilize and whether the engine will be used as a distributed simulation engine or multi-sim engine. This licensing approach reduces EM tool cost by achieving high engine utilization and accelerates EM design closure with increased simulation throughput.

Features

  • Powered by a proven 3D full-wave EM engine to ensure accurate results
  • High-capacity EM engine eliminates missing hard-to-detect EM coupling design flaws
  • Easy to use one-click layout-to-EM Model from Mentor BoardSim and Expedition
  • Combine multiple engines to increase simulation throughput and accelerate EM design closure

Datasheet

HyperLynx 3D EM Resources

HyperLynx Training

We have training courses available for HyperLynx products in our training centers around the world, online, or at your site.

Contact Mentor Graphics

SERDES Design

3D modeling methods in SERDES Designs: Is via behavior causing your SERDES designs to fail?

On-demand Web Seminar: Learn how to evaluate vias through 3D EM Simulation and Post-Route Verification to validate via behavior and its effects on multi-gigabit channels. View On-demand Web Seminar

Where to Buy

HyperLynx 3D EM Tools

HyperLynx 3D EM Engine

The HyperLynx 3D EM engine offers a flexible architecture enabling the user to configure the best match to their needs at launch time. The EM engine can be configured in either a distributed- or multi-simulation mode depending on the hardware computing environment.

HyperLynx 3D EM Designer

HyperLynx 3D EM Designer is the user interface equipped to create a full 3E geometry model directly from BoardSim or Expedition. The Designer provides geometry editing, port definition, and simulation job launch and management facilities to maximize tool access and throughput.

HyperLynx 3D EM SSD

HyperLynx 3D EM SSD is ideally suited for designing monolithic microwave integrated circuits (MMICs), radio-frequency integrated circuits (RFICs), low-temperature co-fired ceramic (LTCC) circuits, high-temperature superconducting (HTS) circuits, radio-frequency identification (RFID) antennas, patch antennas, slot antennas, wire antennas, and most other RF and wireless antennas.