HyperLynx Power Integrity (PI)

PCB Power Integrity Design & Analysis

HyperLynx® Power Integrity (PI) addresses the many power complexities faced by today’s PCB designers. Some of these challenges include:

  • Increasing variety of voltages utilized by ICs
  • Dramatic increases of consumption
  • Reduced layer counts
  • Finer-pitch BGA footprints that perforate copper planes, interfering with DC voltage and current supply

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With inadequate power delivery, designs can exhibit seemingly intermittent signal integrity issues, which cause the logic on the board to fail. If power delivery is extremely poor, there can be complete part failure due to inadequate voltage and/or current resulting in a non-functional design. In severe cases, poor power delivery can lead to thermal issues, reliability issues, and actual copper failure.

Hardware engineers, PCB designers, and signal integrity specialists alike can use HyperLynx PI and generate simulation results without weeks of software training. HyperLynx enables you to:

  • Improve power integrity by identifying power distribution problems early in the design, even prior to layout.
  • Detect problems with your design that would be difficult to spot in the lab
  • Investigate solutions in an easy-to-use what-if environment.

These power integrity capabilities will ultimately help you reduce prototype spins and get to market faster, while creating more reliable products.

Highlights

Reduce development time and cost

  • Reduce design re-spins through up-front planning and virtual prototypes
  • Focus on time-to-results, leveraging HyperLynx’s renowned ease of use coupled with powerful simulation technology

More time for bigger ideas

  • Use the time and money you save to push the creative envelope, coming up with bigger, better ideas to differentiate your products

Lower product costs

  • Explore and validate different design configurations to optimize cost vs. performance tradeoffs
  • Improve reliability through better signal quality in and effective power distribution design

Related Products

HyperLynx Signal Integrity (SI)

Product Overview: Mentor Graphics' HyperLynx® suite enables PCB signal integrity analysis and simulation, even with SERDES applications, quickly and accurately. View Product Overview

HyperLynx 3D EM

Product Overview: HyperLynx 3D EM from Mentor Graphics is a high-capacity electromagnetic design and post-layout verification solution for today’s PCB, packaging, RFIC, MMIC, and planar antenna designs. View Product Overview

Datasheet

Resources

From the Blogs

Need stitching vias?

The HyperBlog

When trying to design SERDES signals on board, designers often receive recommendations on placing stitching vias around differential signal vias of a channel. The purpose is to provide continuous return…View Blog Post

Turn off your phone!

The HyperBlog

Everybody knows you are supposed to turn off your phone and other electronic devices when you are on a plane.  You can leave it on during the flight, but it has to be off for takeoff and landing.  I like…View Blog Post

Testimonials

Bogatin Enterprises Customer Reference

Balancing cost/performance tradeoffs is one of the most significant challenges for today’s designers. With the emergence of power integrity, balancing these issues becomes a surmountable challenge... View Testimonial