Enhancing Multi-Gbps Simulations With The New HyperLynx 3D Full-wave Solver Web Seminar

Web Seminar
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There are currently no dates scheduled for this event. However a recording of a previous session is available as an on-demand web seminar.

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Overview

As system data rates climb to multi-gigabit-per-second (multi-Gbps) levels, it becomes increasingly important to consider the complex effects of non-uniform interconnect discontinuities in addition to other signal integrity issues. This webcast examines the use of full-wave, three-dimensional electromagnetic modeling methodologies to improve simulation accuracy for multi-Gbps systems.

There are two basic types of interconnect discontinuities:

  • Irregularly shaped interconnect elements on the printed circuit board (PCB), such as vias, bends, and non-uniform trace
  • The packages that connect ICs and boards

In the past, static or quasi-static field solvers were used to characterize uniform traces on boards and packages, while small, irregularly shaped elements were approximated or ignored. Such methodologies are sufficient for modeling and simulation of signals with relatively slow edge rates.

For multi-Gbps systems, however, especially those with data rates over 5 Gbps, even discontinuities introduced by small structures on boards and packages can significantly degrade signal quality, resulting in closed eye diagrams and unacceptable bit error rate (BER). Full-wave-based, three-dimensional analysis is needed to account for electromagnetic coupling and wave effects.

This webinar:

  • Presents the importance of advanced electromagnetic modeling methodologies in multi-gigabit system designs
  • Introduces the newly acquired, full-wave 3D solution in HyperLynx
  • Shows how this proven 3D solution can be used to accurately model discontinuities on boards and complex nets in packages
  • Demonstrates design and verification flows using the 3D field solver in the HyperLynx signal-integrity simulation environment

About the Presenters

Presenter Image Dr. Zhen Mu

Dr. Zhen Mu is currently the product market manager at Mentor Graphics, responsible for signal integrity and power integrity products for printed circuit board and package analysis. Prior to Mentor, she worked at Cadence Design Systems as a member of the consulting staff and as the leading technologist for high-speed simulations. At Sycamore Networks, Dr. Mu was the principal signal integrity engineer for high-speed systems designs. Dr. Mu received her B.Sc. and M.Sc. degrees from the University of Science and Technology, Beijing China, in 1982 and 1985, respectively, and her Ph.D degree in Electrical and Computer Engineering from the University of Manitoba, Canada in 1994. Dr. Mu holds two US patents and one Canadian patent.

Presenter Image Dr. Jian-X Zheng

Dr. Jian-X Zheng received the B.S. and M.S. degrees in electrical engineering from Tsinghua University, Beijing China, in 1984 and 1986, respectively, and a Ph.D. degree in electrical engineering from the University of Colorado at Boulder in 1990. He founded Zeland Software, Inc., specializing in 3D full-wave EM simulation products, in 1993. Dr. Zheng has been leading development of the IE3D Full-Wave EM Design System for a broad range of high-frequency and wide-band electronic design applications. Dr. Zheng has more than 26 years of experience developing full-wave EM technologies.

Who Should Attend

  • SI engineers for high-speed digital applications
  • Hardware designers involved in system-level multi-Gbps designs
  • System-level project managers
 

What You Will Learn

  • The effects of interconnect discontinuities on multi-Gbps system designs
  • The importance of using full-wave solutions for high-speed digital applications on PCBs and packages
  • What you can do today with the HyperLynx SI 3D solution

Products Covered

Technical Instructions

Technical Requirements

What do I need to watch and hear this web seminar?

Mentor Graphics’ web seminars are delivered using Adobe Connect. You will be able to login to the seminar room 15 minutes prior to the start time on the day of the presentation. You can hear the audio using your computer’s speakers via VoIP (Voice over IP) and background music will play prior to the beginning of the presentation.

Detailed system requirements

Microsoft® Windows

  • Windows XP, Windows Vista, Windows 7, Windows 8
  • Microsoft Internet Explorer 7, 8, 9, 10; Mozilla Firefox; Google Chrome
  • Adobe® Flash® Player 10.3 or later
  • 1.4GHz Intel® Pentium® 4 or faster processor and 512MB of RAM

Mac OS X, 10.5, 10.6, 10.7.4, 10.8

  • Mozilla Firefox; Apple Safari; Google Chrome
  • Adobe Flash Player 10.3
  • 1.83GHz Intel Core™ Duo or faster processor and 512MB of RAM

Linux

  • Ubuntu 10.04, 11.04; Red Hat Enterprise Linux 6; OpenSuSE 11.3
  • Mozilla Firefox
  • Adobe Flash Player 10.3

Mobile

  • Apple supported devices: iPad, iPad2, iPad3; iPhone 4 and 4 S, iPod touch (3rd generation minimum recommended)
  • Apple supported OS versions summary: iOS 4.3.x, 5.x, or 6.x (5.x or higher recommended)
  • Android supported devices: Samsung Galaxy Tab 2 (10.1), Samsung Galaxy Tab (10.1), ASUS Transformer, Samsung Galaxy Tab (7”) , Motorola Xoom, Motorola Xoom 2, Nexus 7
  • Android supported OS versions summary: 2.2 and higher
  • Android AIR Runtime required: 3.2 or higher

Additional requirements

  • Bandwidth: 512Kbps for participants, meeting attendees, and end users of Adobe Connect applications. Connection: DSL/cable (wired connection recommended) for Adobe Connect presenters, administrators, trainers, and event and meeting hosts.

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