Cost-Saving Techniques for Effective Solder Joint Analysis

Overview

In component land pattern construction, often only limited consideration is given to the appearance and quality of the solder joints. However, for the OEM and Contract Manufacturers involved in the PCB assembly process, these two characteristics are objects of concern and scrutiny. The need for greater profitability and productivity imposes a demand for even higher rates of production and shorter times between setup. The combination of insufficiently constructed component land patterns and the need for higher capacity can negatively impact first-pass yield, and thus requires a high level of repair or rework. This then further impacts delivery, reliability, and eventually customer satisfaction.

In this webinar, we will examine how evaluating the likely quality of the solder joints early in the PCB design and manufacturing process can alleviate the headaches of re-work in the PCB assembly process. Additionally, since the sourcing of components can be an issue, we will look at how to perform effective component placement analysis with alternative components, taking into consideration all possible alternative parts for placement.

What You Will Learn

• How to address the requirement for managing alternate parts within an NPI process
• How and why alternative parts can create an assembly process challenge
• How a component package based part library can validate alternative, geometrically acceptable, parts
• How solder joint quality can change, depending on which component from an alternate list is used during the assembly process

Who Should View

• CAD management with time and cost objectives
• NPI engineers seeking to achieve first pass manufacturability
• PCB designers looking to reduce manufacturing delays through an effective design process