Solving IR Drop Challenges for Effective Power Delivery
On-demand Web Seminar
This session - Solving IR Drop Challenges for Effective Power Delivery - will discuss how power planes are being partitioned into a maze of different voltage islands due to the growing number of voltage rails on modern PCBs, the ever-increasing current requirements, and the need to reduce cost and use fewer layers. This can lead to narrow paths for power delivery - neckdowns that lead to significant voltage drop across the planes and high current densities.
We will also illustrate how analysis of the problem can lead to a more robust power system, allowing you to get to market faster and have confidence in your PCB design.
What You Will Learn
- How DC Drop issues can affect your PCB design
- How to analyze your PCB to quickly pinpoint power delivery issues and explore solutions
- How HyperLynx PI can help solidify your PCB power distribution network
About the Presenter
Patrick Carrier worked as a Signal Integrity Engineer at Dell for 5 years before joining Mentor in September 2005. Patrick is now a technical marketing engineer specializing in analysis products, including signal and power integrity, EMC, and thermal design.
Who Should View
- Power Integrity Specialists, regardless of EDA tools currently used
- Electrical Engineers
- Layout Designers
- Engineering Managers
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