Solving IR Drop Challenges for Effective Power Delivery

On-demand Web Seminar

Abstract

Learn how IR (DC) drop analysis can lead to a more robust power system, allowing you to get to market faster and have confidence in your PCB design.

Duration: 16:44

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Tags

DC Drop, IR Drop, PCB Analysis

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Details

Overview

This session - Solving IR Drop Challenges for Effective Power Delivery - will discuss how power planes are being partitioned into a maze of different voltage islands due to the growing number of voltage rails on modern PCBs, the ever-increasing current requirements, and the need to reduce cost and use fewer layers. This can lead to narrow paths for power delivery - neckdowns that lead to significant voltage drop across the planes and high current densities.

We will also illustrate how analysis of the problem can lead to a more robust power system, allowing you to get to market faster and have confidence in your PCB design. 

What You Will Learn

  • How DC Drop issues can affect your PCB design
  • How to analyze your PCB to quickly pinpoint power delivery issues and explore solutions
  • How HyperLynx PI can help solidify your PCB power distribution network

About the Presenter

Presenter Image Patrick Carrier

Patrick Carrier worked as a Signal Integrity Engineer at Dell for 5 years before joining Mentor in September 2005. Patrick is now a technical marketing engineer specializing in analysis products, including signal and power integrity, EMC, and thermal design.

Who Should View

  • Power Integrity Specialists, regardless of EDA tools currently used
  • Electrical Engineers
  • Layout Designers
  • Engineering Managers

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