Don’t Let Integrated Circuit Power Demands Heat up Your Board
On-demand Web Seminar
Abstract
Learn how to minimize heating effects of power delivery networks (PDN’s) through proper IC power management and thermal design.
Duration: 22:14
Details
Overview
In this webinar we will discuss how to quantify that heating effect with HyperLynx PI/Thermal Co-simulation. Learn how your board can keep its cool and become more dependable through effective power management, design, and analysis.
Modern, power-hungry Integrated Circuits (ICs) have a tendency to really heat up your board design. They not only generate a lot of heat themselves, they also demand a lot of current to operate properly; current that is supplied by the power distribution network (PDN) of the board.
Are you ignoring the heat caused by these currents? Inadequate plane shapes and traces can cause high current densities, which can heat up the board significantly, causing excessive component heating and, in severe cases, copper failure.
What You Will Learn
- How to identify power and thermal problem areas in your board design
- How power issues can lead to thermal problems
- How to create cooler, more reliable board designs
- How to ensure proper power management for integrated circuits
About the Presenter
Patrick Carrier
Patrick Carrier worked as a Signal Integrity Engineer at Dell for 5 years before joining Mentor in September 2005. Patrick is now a technical marketing engineer specializing in analysis products, including signal and power integrity, EMC, and thermal design.
Who Should View
- Board designers, electrical engineers, thermal engineers
- Anyone designing modern PCBs with power-hungry ICs
- Anyone wanting to learn to minimize the heating effects of power delivery networks
- Anyone struggling with integrated circuit power management
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