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Eliminate Costly Delays for Chip on Board and MCM-L Designs

Eliminate Costly Delays for Chip on Board and MCM-L Designs

44:01
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On-demand Web Seminar: Discover techniques to automatically create die components, generate bond pad & wire bond rules and meet design schedule goals. 44:01

Tags: Chip on Board

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Expedition Enterprise Layout and Routing: Implementing Advanced PCB Manufacturing Technologies

Expedition Enterprise Layout and Routing: Implementing Advanced PCB Manufacturing Technologies

36:47
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On-demand Web Seminar: Advanced manufacturing technologies such as HDI, rigid-flex, embedded passives and chip-on-board are being adopted to ensure greater competitive differentiation and performance; this session will discuss... 36:47

Tags: Chip on Board, Design for Manufacturing and NPI, embedded actives, Expedition Enterprise, Layout & Routing

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