Enhancing Multi-Gbps Simulations With The New HyperLynx 3D Full-wave Solver

Overview

As system data rates climb to multi-gigabit-per-second (multi-Gbps) levels, it becomes increasingly important to consider the complex effects of non-uniform interconnect discontinuities in addition to other signal integrity issues. This webcast examines the use of full-wave, three-dimensional electromagnetic modeling methodologies to improve simulation accuracy for multi-Gbps systems.

There are two basic types of interconnect discontinuities:

• Irregularly shaped interconnect elements on the printed circuit board (PCB), such as vias, bends, and non-uniform trace
• The packages that connect ICs and boards

In the past, static or quasi-static field solvers were used to characterize uniform traces on boards and packages, while small, irregularly shaped elements were approximated or ignored. Such methodologies are sufficient for modeling and simulation of signals with relatively slow edge rates.

For multi-Gbps systems, however, especially those with data rates over 5 Gbps, even discontinuities introduced by small structures on boards and packages can significantly degrade signal quality, resulting in closed eye diagrams and unacceptable bit error rate (BER). Full-wave-based, three-dimensional analysis is needed to account for electromagnetic coupling and wave effects.

Who Should View

• SI engineers for high-speed digital applications
• Hardware designers involved in system-level multi-Gbps designs
• System-level project managers

What You Will Learn

• The effects of interconnect discontinuities on multi-Gbps system designs
• The importance of using full-wave solutions for high-speed digital applications on PCBs and packages
• What you can do today with the HyperLynx SI 3D solution