Modern IC packaging technologies, such as 3D-IC, drive the need for IC, package and system co-design tools and methodologies.
Learn why the PADS ES Suite is a natural choice for those using advanced automation like tuning or dynamically updating dialogs.
TAGS: Interactive Routing, PADS
Download our free evaluation package to explore the full functionality of the integrated development environment for the Nucleus RTOS for Freescale i.MX28 processors.
HyperLynx 3D Analysis course will help you gain the ability to accurately model and simulate discontinuities such as vias in PCBs in HyperLynx 3D EM environment.
TAGS: HyperLynx PCB Analysis Software
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