Modern IC Packaging

View All Resources | View All White Papers

White Paper

ABSTRACT

Modern IC packaging technologies, such as 3D-IC, drive the need for IC, package and system co-design tools and methodologies.

Download White Paper

Go URL

Share This Resource

Related Resources

PADS ES Suite Interactive Routing

PADS ES Suite Interactive Routing

Product Demo 02:22
PADS ES Suite Interactive Routing

PADS ES Suite Interactive Routing

Learn why the PADS ES Suite is a natural choice for those using advanced automation like tuning or dynamically updating dialogs.

Interactive Routing, PADS
Abstract

PADS ES Suite Interactive Routing

Learn why the PADS ES Suite is a natural choice for those using advanced automation like tuning or dynamically updating dialogs.

TAGS: Interactive Routing, PADS

View Demo

Nucleus ReadyStart™ for Freescale i.MX28 Evaluation...

Software Evaluation

Nucleus ReadyStart™ for Freescale i.MX28 Evaluation Software

Download our free evaluation package to explore the full functionality of the integrated development environment for the Nucleus RTOS for Freescale i.MX28 processors.
Abstract

Nucleus ReadyStart™ for Freescale i.MX28 Evaluation Software

Download our free evaluation package to explore the full functionality of the integrated development environment for the Nucleus RTOS for Freescale i.MX28 processors.

View Evaluation

HyperLynx 3D Analysis

Training course Jul 9–10 : Singapore, Singapore
Abstract

HyperLynx 3D Analysis

HyperLynx 3D Analysis course will help you gain the ability to accurately model and simulate discontinuities such as vias in PCBs in HyperLynx 3D EM environment.

TAGS: HyperLynx PCB Analysis Software

View Training course