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Getting Started in HDI Fabrication

Posted in: Design Creation

High-density interconnect (HDI) fabrication is the fastest growing segment of the printed circuit industry. From its simple start in 1985 for Hewlett-Packard's first 32-bit computer (the Finstrate) to today's large client servers with 36 sequentially laminated layers and stacked microvias, HDI/microvia technologies are the PCB architectures of the future. Smaller component pitches, larger ASICS and FPGAs with more I/O, embedded passives and higher frequencies with shrinking rise-times all require smaller PCB features, driving the need for HDI/microvia. This paper outlines the six simple processes in PCB fabrication that have to be improved in order to successfully build highly reliable HDI/microvia boards.

The conclusion of this paper emphasizes the business opportunities and challenges faced by management in starting and developing the HDI fabrication business including the engineering challenges of improving yields.

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Leveraging FPGA in PCB System Designs: Optimizing Profit Margin

Posted in: Design Creation

Any design project that leverages Field Programmable Gate Arrays (FPGAs) to implement system designs has the opportunity to:

  • Reduce total design cycle time by as much as 50%
  • Minimize PCB manufacturing costs
  • Optimize product profit margin

Early adopters of PCB Optimization technology have validated the concept that FPGA package flexibility can deliver substantial business benefits.

This white paper documents the impact of decisions made during the design of the FPGA-PCB interface, from the assignment of the PCB signal to the FPGA package pins through their effect on product profit margin.

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Meeting the Connectivity Challenge

Posted in: Design Creation

 FPGAs are increasingly used in bridging and connectivity functions. At a high level, these basic functions are common across the major industries served by FPGAs, including telecom, datacom, and storage.

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