PCB White Papers
Getting Started in HDI Fabrication
High-density interconnect (HDI) fabrication is the fastest growing segment of the printed circuit industry. From its simple start in 1985 for Hewlett-Packard's first 32-bit computer (the Finstrate) to today's large client servers with 36 sequentially laminated layers and stacked microvias, HDI/microvia technologies are the PCB architectures of the future. Smaller component pitches, larger ASICS and FPGAs with more I/O, embedded passives and higher frequencies with shrinking rise-times all require smaller PCB features, driving the need for HDI/microvia. This paper outlines the six simple processes in PCB fabrication that have to be improved in order to successfully build highly reliable HDI/microvia boards.
The conclusion of this paper emphasizes the business opportunities and challenges faced by management in starting and developing the HDI fabrication business including the engineering challenges of improving yields.
More White Papers
Leveraging FPGA in PCB System Designs
FPGA devices create compelling business drivers generating a tidal wave of FPGA adoption for the implementation of system PCB designs. Obviously, the time to market advantages and capacity/performance characteristics of FPGA devices have delivered on the promise for a viable alternative to more capital resource intensive custom IC/ASIC solutions as well as a successful consolidation vehicle for standard “off the shelf” components in system design creation.
Leveraging FPGA in PCB System Designs: Optimizing Profit Margin
Any design project that leverages Field Programmable Gate Arrays (FPGAs) to implement system designs has the opportunity to:
- Reduce total design cycle time by as much as 50%
- Minimize PCB manufacturing costs
- Optimize product profit margin
Early adopters of PCB Optimization technology have validated the concept that FPGA package flexibility can deliver substantial business benefits.
This white paper documents the impact of decisions made during the design of the FPGA-PCB interface, from the assignment of the PCB signal to the FPGA package pins through their effect on product profit margin.
When FPGA I/O Design Becomes a Necessity
Design teams are being forced to implement urgent changes to unite their HDL, FPGA and PCB flows to ensure they do not negate the cost and time-to-market advantages of using programmable logic. This paper details how Mentor Graphics' and Altera's combined flow overcome the challenges of rising device complexities and higher costs when integrating programmable logic devices on the PCB.
Meeting the Connectivity Challenge
FPGAs are increasingly used in bridging and connectivity functions. At a high level, these basic functions are common across the major industries served by FPGAs, including telecom, datacom, and storage.