Advanced HDI BGA Technologies Workshop: Hands-on Design
Overview
HDI (High Density Interconnect) was first developed in the late 80's to complement VLSI chips that had very low-drive characteristics - hence the need for low inductance and capacitance vias. At that time, usage was limited to the most expensive electronics until two new trends emerged: Portable Electronics and BGA Packaging!
HDI is now the fastest growing segment of PCB fabrication and one that offers the most advantages in enabling higher density and, critically, at a LOWER COST.
This Workshop will be led by Happy Holden who is a respected speaker on PCB topics and future technology strategies. He has a strong industry reputation with deep knowledge about today's advanced PCB fabrication technologies.
The workshop runs from 9am til 5pm at Mentor Graphics Newbury office and includes detailed lecture theory, material selection and techniques for designing, producing and manufacturing HDI PCBs. The afternoon is predominantly hands-on providing step-by-step instruction to breakout & fanout large I/O and fine-pitch BGAs with an emphasis on High Speed nets & Signal Integrity . Each delegate will work at a workstation using Mentor Graphics ExpeditionPCB(TM) design software and gain experience of the Advanced Interconnect option to practice connecting three advanced BGAs using HDI-Microvias.
Registration
Space on this workshop is limited. Please register for a space. Applicants will be confirmed on June 5th
Who Should Attend
- Experienced PCB Layout and/or ECAD engineers
- Managers responsible for PCB design and production
The hands-on aspect of the workshop uses Expedition PCB but no previous experience of this tool is required, however, all delegates will need to have several years experience of PCB design.
What You Will Learn
- Introduction to Advanced Printed Wiring Boards (PWBs) and Microvias (HDIs) design
- Benefits of HDI
- Applications of HDI to high I/O and fine-pitch BGAs -The three most popular HDI stackups for complex BGA routing
- Automating the processes of creating fanouts of large, complex BGAs
Hands-On Content
Each delegate will breakout and fanout components with the following characteristics:
- FPGA device - 1517 I/O BGA at 0.8 mm pitch
- Microprocessor - 948 I/O MicroBGA at 0.65 mm pitch
- Digital signal analyzer (DSA) - 498 I/O CSP at 0.5 mm pitch
Each delegate will autoroute the HDI-microvia board to appreciate the time, size and reduced layer saving that the technology enables. The workshop complements a new book written by Mentor’s Charles Pfeil titled "BGA Breakout & Routing- Effective Design Methods for very large BGAs"