Expedition Industry Articles
2007
Addressing EMI test challenges in nextgen high density interconnect PCB design
HDI Via Structures' Effect on PCB Design Flexibility, Constraints, and Cost
DfT Yields Bottom-line Returns
Embedded Passives' Role in 3D Packaging
Rigid-Flex Technology: Mainstream Use but More Complex Designs
Design and Manufacturing Collaboration, a New Paradigm? - CircuiTree
Modeling Issues in High-Speed Simulation
Reducing RF design cycles through improved design methodologies
Next Generation PCB Design Constraint Management
How to Capture & Share Intellectual Property in PCB Design
Designing Virtex-5 DDR2 Memory Interfaces for Signal Integrity
Altera Makes Its Advanced Signal Integrity Technology Available Through EDA Partners
Two-way street: Transmission lines support traffic in two directions
2006
Microelectronics Design and Manufacturing (Advanced Packaging)
Guide to Rigid-Flex Design (PCD& M)
Mentor Topology Router Automaps Buses (EE Times)
A Fundamentally Different Approach to FPGA I/O Design - Xcell Journal
Preparing for the ‘Left Shift’ in Design for Fabrication Analysis
2003
Mentor tool will team up on pcb layout
Signal-integrity Product Adds Features
Collaborative Tool Squashes PC-Board Design Cycle
Mentor Graphics Boosts Pc-board Signal Integrity
Simulation of High-Speed Serial Interconnect Required Broad Model Support
Serial Tsunami Requires Changes to SI Verification and Planning
The Jump to Light Speed (Megabit to Gigabit)
Simulation of Ultra-fast Serial Data Channels Using Advanced Modeling Techniques
