Silicon Test and Yield Analysis
The Tessent® Product Suite
Tessent combines features of deterministic scan testing, embedded pattern compression, built-in self test, specialized embedded memory test and repair, and boundary scan, as well as board and system-level test technologies.
The Tessent product suite provides comprehensive silicon test and yield analysis solutions that address the challenges of manufacturing test, debug, and yield ramp for today’s SoCs. Built on the foundation of the best-in-class solutions for each test discipline, Tessent brings them together in a powerful test flow that ensures total chip coverage.
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Tessent Silicon Test & Yield Analysis Solution
Logic Test
Mentor Graphics offers the industry’s most powerful suite of logic test solutions with more than a decade, and thousands of tape-outs, of successful high-quality test using both compression and vectorless approaches.
Memory Test
Tessent® memory test solutions include comprehensive test and diagnostic capabilities to address the quality requirements of new process nodes and memory designs as well as comprehensive repair analysis and self-repair capabilities.
Mixed-Signal Test
The Tessent® mixed-signal test solutions are vendor- and ATE-independent, addressing the growing number of SerDes interfaces and PLLs on today’s SoC designs.
Silicon Learning
The Tessent® silicon learning products increase productivity during critical silicon validation and yield ramp phases, providing solutions for test bring-up, silicon characterization, diagnosis-driven yield analysis, and failure analysis.
White Papers
Automated Test Creation for Mixed Signal IP using IJTAG
The creation of test patterns for mixed signal IP has been, to a large extent, a manual effort. To improve the process used to test, access, and control embedded IP, the new IEEE P1687 standard 1 is being... View White Paper
Ready for 3D-IC
This technical presentation describes the challenges and Mentor's solutions for verifying and testing IC designs targeted for 3D packages, such as stacked die using TSVs or multi-die packages using silicon... View White Paper
Low Power Test
Today’s advanced integrated circuit (IC) designs are increasing in complexity, with their seemingly endless progression to smaller geometries, ever increasing integration between analog and digital... View White Paper
Multimedia
Tessent Product Suite Overview
Built on the foundation of the best-in-class test tools for each test discipline, Tessent® brings these solutions together in a powerful test platform that ensures total chip coverage. View Technology Overview
Optimizing Yield and Performance in a Nanometer World
Optimize Yield and Performance in a Nanometer World View Technology Overview
Mentor Graphics support of ARM IP
This video is an overview of the partnership between ARM® and Tessent®, Mentor Graphics silicon test solutions product group. Tessent and ARM co-developed support for the ARM shared bus where MemoryBIST... View Technology Overview
