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Apply Memory BIST to External DRAMs

Technical Article

Apply Memory BIST to External DRAMs

3D-stacked designs containing a mix of separate logic and memory die represent a somewhat new application for memory BIST (built-in self-test), compared to the more conventional single-die embedded SRAM implementations. Gaining access to a DRAM requires predefined customized memory operations that provide a cost-effective solution for testing 3D ICs. EDA tools must make this definition step as simple as possible, while ensuring it can be reused across designs and over time. Read more

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About Shelly Stalnaker

Shelly StalnakerI believe in the well-written sentence, the eye-catching title, and the satisfaction of hearing someone say, “Now I get it.” I believe there ought to be a constitutional amendment outlawing the use of the third person and passive tense in technical writing. I believe a writer can explain and entertain at the same time, and I believe that everyone, even in the business world, has a story to tell. Visit Foundry Solutions

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