Optimizing yield and performance in a nanometer world

There are currently no dates scheduled for this event.

Overview

GLOBALFOUNDRIES / Mentor Graphics Seminar at DATE

Delivering a correct, high yielding product on time is the ultimate goal for a semiconductor development team. Reaching this goal becomes more and more difficult, as systematic defects to a larger degree are design specific. This event describes methodologies that drive yield of digital semiconductor devices through design and test data, augmenting traditional solutions. This flow can be implemented as a foundation of a collaborative process between fabless and foundry customers, benefiting both sides. It presents fast, high quality volume diagnosis and subsequent statistical analysis as two complementing technologies to carry out this methodology. The underlying technology key to the methodology is an extremely accurate and consequential single-die diagnosis of scan test failures. This gives failure analysis engineers or engineers involved in nondestructive testing and evaluation, a proven, very fast, and highly effective new way of defect localization and identification, complementing their traditional, hardware-based methods.

What You Will Learn

• Best practices for data collection and diagnosis of digital semiconductor devices in a fabless/foundry flow
• Techniques to pick the correct dies for an effective failure analysis
• Layout-aware diagnosis
• Diagnosis-driven yield analysis
• DFM-aware yield analysis
• Case studies based on 32nm and 28nm silicon data

DATE Conference

Design, Automation & Test in Europe
International Congress Center
12 - 16 March, 2012 - Dresden, Germany