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3D IC Test

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Description

3D-IC technology has been getting a lot of attention in the press and at technical conferences. Whether the 3D-IC is built on Silicon Interposers or stacked die with Through Silicon Vias, Mentor Graphics is uniquely positioned to support our customers with both the Calibre and Tessent product lines.

Design Areas: Silicon Test and Yield Analysis | Products: Tessent FastScan, Tessent LogicBIST, Tessent MemoryBIST, Tessent TestKompress

 
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