BIST Techniques for Delay and Jitter
Tessent Product Suite Overview
Built on the foundation of the best-in-class test tools for each test discipline, Tessent® brings these solutions together in a powerful test platform that ensures total chip coverage.
Tessent Test Solutions: Advanced Solutions Covering Both the 2D and 3D Spaces - DAC 2012
The growing adoption of 3D packages is driving new test needs like very low pre-packaged die escape rates, and new test access methods for stacked die in packages. Come to Mentor’s silicon test session...