Ready for 3D-IC
White Paper
ABSTRACT
This technical presentation describes the challenges and Mentor's solutions for verifying and testing IC designs targeted for 3D packages, such as stacked die using TSVs or multi-die packages using silicon interposers.
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On Semiconductor
Success StoryOn Semiconductor
On Semiconductor's automotive products division, located in East Greenwich, Rhode Island, has completed multiple successful tape outs using the Pyxis® Custom IC Router, including a highly integrated,...