SPICE and Beyond with SystemVision

ABSTRACT

This presentation starts with familiar SPICE modeling methods. But it then quickly goes beyond the limits of SPICE, exploring important design aspects other than pure analog-electronics. This includes tracking the power dissipation in various components, and modeling thermal dynamic effects like self-heating and thermal protection. It shows how digital logic blocks can be added (via “drag-and-drop”) to the system model, and then simulated either natively in SystemVision or in ModelSim. Parametric design analysis techniques are used throughout, including statistical and deterministic methods. This process leads to robust designs that are ready for cost effective, high yield manufacturing.