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Technology Overview: 3D-IC technology has been getting a lot of attention in the press and at technical conferences. Whether the 3D-IC is built on Silicon Interposers or stacked die with Through Silicon Vias, Mentor Graphics... View Technology Overview3D-IC System Verification Methodology: Solutions and Challenges
White Paper: Presents a verification methodology for 3D-ICs, including connectivity checking and parasitic extraction. Discusses new challenges and EDA tools to responds to those challenges. An example illustrates... View White Paper
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