Resources
Showing: 1-9 of 9 total resources
| Resource | Type | Design Area |
|---|---|---|
| Tessent Test Solutions: Advanced Solutions Covering Both the 2D and 3D Spaces - DAC 2012 | Technology Overview | Silicon Test and Yield Analysis |
| Modern IC Packaging | White Paper | PCB Design Software & Tools |
| Ready for 3D-IC | White Paper | Silicon Test and Yield Analysis , IC Design |
| Cross Design Team Interconnect Planning | White Paper | PCB Design Software & Tools |
| 3D-IC System Verification Methodology: Solutions and Challenges | White Paper | IC Design |
| 3D IC Test | Technology Overview | Silicon Test and Yield Analysis |
| Tessent Support for Testing 3D-ICs | Datasheet | Silicon Test and Yield Analysis |
| 3D-IC Testing with the Tessent Platform | White Paper | Silicon Test and Yield Analysis |
| 3D-IC Design Challenges - 2011 GlobalPress Keynote | Technology Overview | IC Design |
Showing: 1-9 of 9 total resources
3D-IC Design and Test Resources
3D IC Test
Technology Overview: 3D-IC technology has been getting a lot of attention in the press and at technical conferences. Whether the 3D-IC is built on Silicon Interposers or stacked die with Through Silicon Vias, Mentor Graphics... View Technology Overview
3D-IC System Verification Methodology: Solutions and Challenges
White Paper: Presents a verification methodology for 3D-ICs, including connectivity checking and parasitic extraction. Discusses new challenges and EDA tools to responds to those challenges. An example illustrates... View White Paper
View all 3D-IC Design and Test Resources: White Papers, Datasheets, Web Seminars, and more