Olympus-SoC Place and Route
Manufacturing-Aware Physical Implementation
Olympus-SoC™ is a sophisticated, manufacturing-aware physical implementation system designed for the rigorous place and route requirements of today’s nanometer designs. Built on a patented multi-CPU, MCMM timing kernel, Olympus SoC provides concurrent analysis of critical design metrics such as timing, power, area, signal integrity and lithography across all corner/mode scenarios.
Olympus-SoC fully understands systematic variability and integrates powerful DFM functions seamlessly. Features such as variability-aware MCMM optimization, litho-driven routing, and concurrent co-optimization of all closure criteria (including DRC/DFM, timing, power, signal integrity, performance, and area) ensure your layout is highly manufacturable.
Olympus-SoC’s advanced software architecture is inherently scalable, and includes both an extremely efficient graph representation for timing information and a very concise memory footprint.
All Olympus-SoC capabilities are built on a Multicorner-multimode timing kernel.
DFM capabilities are built in to the Olympus-SoC 45 nm-ready router, so tasks you once had to perform as post-processing steps, like double via insertion, cell swapping, wire widening, and wire spacing, are now completed automatically during route optimization to provide you with a “correct-by-construction” implementation.
What Olympus-SoC provides you:
- Better IC performance
Incorporate variability models from your fab with other libraries and constraints for concurrent optimization across any number of MCMM scenarios. - Improved yield
Address manufacturability in a timing context during implementation using correct-by-construction, litho-driven routing. - Faster closure
Radically reduce your design iterations with concurrent co-optimization of all closure criteria across all corner/mode scenarios. Shorten your design time with incremental extraction and multi-threaded, multi-CPU engines. - Flexible design flow, easy tool adoption
Simplify your design flow with a physical design solution that accepts all standard industry formats, has a full Tcl scripting interface, and a flexible API. Olympus-SoC easily plugs into your existing methodologies. DRC/DFM capabilities are built into the flow, becoming virtually transparent to the user.
The Olympus-SoC flow is based on the MCMM timing core, and is fully multi-threaded for parallel execution in every step of the flow, including timing analysis and optimization. (Click to view larger)
Olympus-SoC
Advanced multi-corner, multi-mode, (MCMM) technology and lithography-driven routing. Learn more about Olympus-SoC
Olympus-SoC Overview
Technology Overview: The Olympus-SoC™ Design for Variability IC implementation solution is purpose-built to address the performance, capacity, time-to-market, and variability challenges at advanced nodes. With full support... View Technology Overview
- White Paper: Implementation-Quality Prototyping with Olympus-SoC: Accelerating Design Closure for Advanced ICs
- White Paper: Deflecting the Design Diversity Dilemma: Methods for Improving Mixed-Signal Post-Layout Analysis in an SoC Flow
Contact Mentor Graphics
- Request Information or call toll free: 1-800-547-3000
More Products
Manufacturing Variability Challenges
Design
Mentor’s variability-aware/timing-aware place and route system delivers “correct-by-construction” layouts concurrently optimized for both performance and yield across any number of modes and corners.
Enhance
Mentor’s Calibre® platform provides the fastest, most accurate, and most reliable integrated verification, extraction and design-for-manufacturing (DFM) platform for both library cells and full chips.
Fabricate
Mentor’s fast, accurate, and cost-effective mask resolution enhancement and data prep flows ensure quick mask turnaround and high manufacturability at 65 nm, 45 nm, 32 nm and beyond.
Ramp
Mentor’s production yield solution combines the power of diagnosis-driven yield analysis and high-quality manufacturing test to accelerate yield ramp.
Manufacturing Variability Resources
Advanced Memory Cell Characterization with Calibre xACT 3D
White Paper: Memory designers need to increase bit density to meet exacting specifications for fast data transfer and low power consumption. Higher density increases the interactions between interconnect and devices,... View White Paper
U8500 Smartphone Platform at the Head of the Class with Calibre SmartFill Technology
White Paper: When ST-Ericsson began development of the next-generation U8500 chip, they knew they would face design and implementation challenges. Not only did the U8500 have an aggressive schedule but it also had aggressive... View White Paper
News
- IEEE Board of Directors Elevates Janusz Rajski to the Grade of IEEE Fellow
- Mentor Graphics and JEOL to Develop Advanced IC Mask Writing Solutions
- Mentor Graphics Announces Completion of 20 nm Test Chip Tapeout with STMicroelectronics Using Olympus-SoC Place and Route System
- Mentor Graphics and TSMC Address Advanced Node Fill Requirements Using Calibre SmartFill
View all Manufacturing Variability Resources: White Papers, Datasheets, Web Seminars, and more

