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Basic Knowledge of Electronics Cooling

Categories: FloEFD, FloTHERM, FloVENT

This course provides an introduction to electronics cooling. View course highlights ↓

Classroom

Full instructor-led courses in a Mentor training facility, with complete course materials and access to classroom computers.

Date Location Time Language Price
Nov 25–262014 Stuttgart Germany 9:30–5 PM
CET
German 1,300 EUR Register
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Course Highlights

In order to understand the transport mechanisms for heat transfer, the effects are characterized and their corresponding equations are refreshed without going too deep into mathematics like differential equations. By applying the equations to practical examples, the student will learn how to approach his own cooling tasks, perform rough calculations and to understand the limiting steps in the heat transfer path. A variety of cooling aspects are discussed, including the thermal contact resistance, cooling with fans, heat sinks and special cooling techniques, as well as fluid dynamic basics of the moving medium.

Key topics

Day 1

  • Introduction
  • Overview "Electronic Cooling"
    • Classification
    • Overview
    • Analogy Thermal Resistance - Electrical Resistance
    • Heat dissipation for Microprocessors
    • Heat flux
    • Temperature and failure rate
  • Heat Conduction
    • Mechanism
    • 1-dimensional without heat sources
    • Boundary conditions for the Differential Equations
    • 1-dimensional with multiple layers
    • 1-dimensional cylinder
    • 1-dimensional with uniform heat source
    • heat spreading
    • 3-dimensional
    • Example
  • Convective Heat Transfer
    • Mechanism
    • the heat transfer coefficient
    • flow close to a wall
    • flow boundary layer
    • the heat transfer coefficient
    • dimensionless numbers
    • laminar and turbulent flow
    • forced convection
    • forced convection, flat plate
    • Example
    • forced convection, tube/gap flow
    • natural convection
    • vertical plate
    • horizontal plate
    • Example
    • Equations from literature
  • Thermal Contact Resistance
    • Mechanism
    • Equations
    • Minimisation
  • The Moving Medium / pressure drops
    • Energy equation (heat)
    • pressure drop
    • flow in tubes (gaps)
    • pressure drop through perforated plates

Day 2

  • Radiation
    • Mechanism
    • Radiation between two parallel surfaces
    • Radiation between two surfaces, one enclosing the other
    • Radiation between two surfaces with arbitrary orientation
    • Radiation between two parallel surfaces limited in size
    • Radiation between two surfaces rectangular to each other
    • Radiation - Role in Electronic Cooling
  • Cooling with Fans
    • Motivation
    • Position
    • First dimensioning
    • Axial Fans
    • Radial Fans / Blowers with housing
    • Mixed Flow Fans
    • Analogy between flow rate and Electrical Current
    • Operating point
    • Comparison Axial Fan / Blower
    • Fans in parallel and serial arrangement
    • Influence of walls
    • Variofans
    • Operating point and acoustic noise emission
  • Heat Sinks
    • Surface extension
    • Heat Sink shapes
    • Special Heatsink solutions with fans
    • Dimensioning
    • Shape variables
  • Special Cooling Techniques
    • Heat Pipes
    • Peltier Elements
    • Cooling Cushions
    • Contact Stripes
    • Thermal Grease
  • Practical Approach
  • Questions and Answers

Course Details

Prerequisites

Electronics/Mechanical Engineers with responsibility for thermal behavior of electronic equipment

Engineers who are new to thermal simulation and wish to develop practical knowledge to back up their simulation expertise

The course is also suitable as a refresher course for engineers who have had a long break in this area

Course Part Number
  • Instructor-led: 241329
Products Covered
  • None

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