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Expedition PCB Advanced Packaging

Categories: Expedition

The Expedition Advanced Packaging Bndl enables 3D Advanced packaging design in Expedition. This includes IC packaging, MCM/Hybrid Design and Mixed signal SiP design. 3D Wire bonding, Chip Stacking, substrate cavities as well as integral embedded passives are supported in this flow and are covered in this class. View course details ↓

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You will learn how to

  • Create library for wire bonding
  • Set up and implement 3D wire bonding including chip to chip and RF wire bonding
  • Set up and implement chip stacking
  • Create substrate cavities and place parts in cavities.
  • Evaluate feasibility for embedded passive technology
  • Set up a material and process library for embedded integral passive parts
  • Implement embedded passives in Expedition

Hands-on labs

  • Creation of die pin pad stacks
  • Creation of Bond pad pad stacks
  • Creation of wire bondable chip component in Central library
  • Adding a substrate cavity
  • Placing parts in cavities and implement wire bonding
  • Creating embedded integral resistors
     

 

Course Information

Intended for

Design and CAD Engineers who will use Expedition Advanced Packaging Bndl

Managers who want to understand Mentors Advanced Packaging capabilities  

Prerequisites

Familiarity with the concepts of wire bonding, cavities, chip stacking

Familiar with the use of DxDesigner and Expedition tools in general

Course Part Number
  • Classroom: 252535
  • Live online: 252536
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