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Thermal Management of Electronic Systems

Categories: FloEFD, FloTHERM, FloVENT

The objective of this course is to provide designers with an understanding of the principles and practice of thermal management. View course details ↓

Classroom

Full instructor-led courses in a Mentor training facility, with complete course materials and access to classroom computers.

Date Location Time Language Price
Feb 18–192015 Hampton Court United Kingdom 9–5 PM
GMT
English 900 GBP Register
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Course Highlights

Thermal management has become a critical aspect in the design of contemporary electronic systems. Power dissipation levels have grown due to increased functionality and greater degrees of integration, and careful thermal design is imperative in order to meet today’s stringent requirements for reliability.  A theoretical basis is used to establish useful design techniques, and these techniques are illustrated through a set of six practical case studies. The cases span a range of applications from portable devices and consumer products to telecommunications rack systems and industrial power sets. Each case will include a review of relevant theory and the application of contemporary tools and techniques to achieve a successful thermal design.

You will learn how to:

Day 1

  • Introduction
  • Thermal Management
  • Power Trends and Environmental Loads
  • Energy Considerations
  • Overview of Course
  • Principles of Heat Transfer
  • Conduction
  • Convection – The Boundary Layer
  • Radiation
  • Electro-Thermal Analogues

Case Study 1: Portable Devices

  • Hand Held Communications Device
  • Component and PCB Level Cooling
  • Component Characteristics
  • Compact Models
  • Factors of Influence for Natural and Forced Convection Cooling
  • Conductive Heat Spread in PCBs Current Carrying Capability
  • Thermal Design Guidelines for PCBs

Case Study 2: Consumer Products

  • Set Top Unit
  • Temperature Effects and Reliability
  • Contemporary Reliability Models
  • Influence of Temperature
  • Failure Physics Approach
  • Heat Sinks
  • Overview
  • Natural Convection Heat Sinks
  • Forced Convection Heat Sinks

Day 2

Case Study 3:

  • Outdoor Systems
  • Base Station for Telecommunications
  • System Cooling
  • Fan and System Characteristics
  • Fan Location
  • PCB and Fan Interactions
  • Cooling at Altitude

Case Study 4: Telecomms Rack Systems

  • Fan Tray Design and Air Distribution

Case Study 5: Power Systems

  • Heat Sink for Power Module

Case Study 6: Fan Cooled Systems

  • Fan Cooled Distribution System
  • Acoustic Noise
  • Definitions
  • Noise Sources and Minimization
  • Case Study
  • Heat Pipes and Liquid Cooling
  • Liquid Properties
  • Heat Pipe Fundamentals and Application Notes
  • Pipe Flow and Pump Characteristics
  • Primary and Secondary Heat Exchange
  • Temperature Measurement
  • Airflow and Pressure Measurement
  • Acoustic Noise Characterization
  • Thermal Management Trends
  • Drivers and Challenges
  • Key Technologies
  • Thermal Design Tools

Course Information

Intended for

Hardware engineers, particularly those working on high power or temperature sensitive applications such as telecommunications, computing or power systems. 

Engineers and managers with responsibility for the thermal design of electronics

Engineers interested in the challenges currently faced by leading electronics companies

Prerequisites None
Course Part Number
  • Classroom: 241341
 
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